产品与市场
S1190G
特点
● 优异的耐CAF性能，耐高压性能
● 高Tg 200℃(DMA)
● 较低的Z轴膨胀系数
● 优异的耐热性
● 不含卤素、锑、红磷等成分
应用领域
● 厚铜电源
● 电源模组
● 高电压应用产品
● 工控和医疗电子
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 190 | |
|
IPC-TM-650 2.4.24 |
TMA |
℃ |
180 | ||
|
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
200 | ||
| Td | IPC-TM-650 2.4.24.6 | TGA(5% wt. loss) | ℃ | 408 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | |
| After Tg | ppm/℃ | 180 | |||
| 50-260℃ | % | 1.8 | |||
| CTE (X/Y-axis) | IPC-TM-650 2.4.25 | Before Tg | ppm/℃ | 11/13 | |
|
T260 (With Cu) |
IPC-TM-650 2.4.24.1 |
TMA | min | >60 | |
| T288 (With Cu) | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃/10s/6cycles, solder dip | - | Pass | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ.cm | 6.0 x 108 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 |
C-96/35/90 |
MΩ | 8.0 x 107 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 181 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+KV NB | |
|
Dissipation Constant (Dk) RC52% |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.3 | |
| Dissipation Factor (Df) RC52% | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.011 | |
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm | 1.3 | |
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 560 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.11 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
Remarks:
1. All the typical value is based on the 1.6mm(8*7628) specimen. The Dk and Df value is based on 50% RC.2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights fromthis data sheet are reserved by Shengyi Technology Co., Ltd.